Automatic Bonding Machine for MicroLED

Product Overview

This automated bonding system is engineered to handle the delicate nature of MicroLED bonding, ensuring micro-conductive particles within the ACF remain intact while maintaining perfect pressure, temperature, and vacuum control. From film cutting to final lamination, every step is fully automated to maximize throughput and consistency.

Application

Unidirectional conduction between MicroLED chips and circuit substrates using ACF film.

Ideal for next-generation display manufacturing, including ultra-high-resolution MicroLED panels.

Suitable for mass production environments requiring consistent bonding quality and reduced defect rates.

Key Technical Features

1, Advanced Film Handling & Placement

• - Laser cutting of ACF film for clean, precise shapes.
• - Automated pick-and-place eliminates severe deformation caused by vacuum suction.

2, Advanced Film Handling & Placement

• - Precisely meets pressure requirements for ACF micro-particles without crushing them, ensuring optimal electrical conduction.

3, High-Precision Environmental Control

• - Accurate control of vacuum degree, temperature, and humidity during the film attachment process.
• - Maintains ultimate vacuum of 1.0E-5 mbar for contamination-free bonding.

4, Integrated Optomechanical-Electrical Coordination

• - Perfect synchronization of vision alignment, motion control, and pressing mechanism for high repeatability and accuracy.

5, Bubble-Free Lamination

• - Special lamination process prevents bubbles, ensuring flawless optical performance in the final display.

Technical Specifications

Ultimate Vacuum - 1.0E-5 mbar

Temperature Uniformity - ≤ 3°C

Leak Rate - < 1.0E-4 Pa·L/S

Pressure Uniformity - ≤ 0.3%

Pressure Range - 0.01 kg ~ 730 kg

Controllable Press Plate Temperature - Up to 300°C

Automated Workflow

From material preparation to final attachment, the process is fully automated for maximum efficiency and repeatability:

Laser Cutting - Precision shaping of ACF film.

Release Paper Removal - Clean, damage-free separation.

Automated Transport - Film is positioned with micron-level accuracy.

Film Attachment - Controlled temperature, humidity, and vacuum ensure perfect adhesion.

Pressing & Bonding - Uniform pressure application within a tightly controlled environment.

Advantages of the Openex MicroLED Bonding Solution

Zero-Defect Bonding - Advanced alignment and process control eliminate bonding failures.

Higher Yields - Reduced material waste and rework through precision automation.

Process Stability - Continuous monitoring ensures every cycle meets strict production tolerances.

Scalable for Mass Production - Designed for 24/7 high-throughput manufacturing lines.

Industry-Leading Accuracy - Meets the requirements of next-generation display assembly.

Applications Across Industries

Display Manufacturing - MicroLED, MiniLED, OLED hybrid bonding.

Consumer Electronics - High-resolution wearable displays, AR/VR devices.

Automotive Displays - High-brightness, long-lifespan MicroLED dashboards.

Industrial Panels - Rugged displays for extreme environments.

Why Choose Openex

With deep expertise in machine vision, AI-driven process control, and precision automation, Openex delivers turnkey bonding solutions that integrate seamlessly into your production line. Our team ensures smooth deployment, operator training, and ongoing technical support to keep your production at peak efficiency.

Get in Touch

Looking to integrate MicroLED bonding automation into your production line?
📩 Contact Openex today for a customized proposal tailored to your manufacturing needs.